Intrinsyc Tech Blogs

27 Jul 2018

Deploying CV/DL/AI on Intrinsyc’s Open-Q™ 820 Development Kit

Artificial Intelligence is one of the breakthrough technologies in computer science. Image/voice recognition and face detection are challenging parts for the machine detection of objects. Most complex mobile Machine Deep Learning (DL) and Computer Vision (CV) tasks are currently performed...

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04 Jul 2018

Device Driver Development Overview In Unified Extensible Firmware Interface (UEFI)

Today’s embedded systems come to market with increased functionality and more complex features than ever before. With these more powerful capabilities, there are increased requirements on embedded device design for: Security, greater memory capacity access, peripheral address space access immediately...

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26 Apr 2018

Running Power Consumption Measurements on Embedded Systems

17 Jan 2018

Oreo for Open-Q™ 820

  Intrinsyc Technologies Corporation has released Android 8 “Oreo” for both the Open-Q™ 820 Development Kit and the Open-Q™ 820 µSOM Development Kit. This new BSP software is now available to register 820 or 820 µSOM customers for download from...

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10 Jan 2018

How to use the Snapdragon™ Neural Processing Engine (NPE) SDK with the Open-Q™ 820

11 Sep 2017

Running OpenCL Sample Application on Open-Q™ 820 System on Module, powered by Qualcomm® Snapdragon™ 820 SOC

17 Jul 2017

The Future of Wearables: Open-Q™ 2100

06 Jun 2017

Intrinsyc’s George Reznik wins Top CFO at 2017 BC CFO Awards

17 May 2017

OPEN-Q™ 212 SINGLE BOARD COMPUTER

15 May 2017

Open-Q™ 410 Development Kit Android Release 1.4.2

Author: Brad Walker, Senior Software Engineer

16 Jan 2017

Android Loadable Module Signing

  Recently, there have been several questions posted to Customer Support (https://www.intrinsyc.com/contact-support/) here at Intrinsyc that asks how one signs a Linux loadable module for our Android and Linux BSPs. While this blog focuses on the Android BSP, the logic...

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