Snapdragon™ 865 Mobile Hardware Development Kit -

Snapdragon™ 865 Mobile Hardware Development Kit

Tech Specs


  • Qualcomm® Snapdragon™ SM8250 – 64-bit octa-core Kryo™ 585 Processor
    • Three high-performance Gold cores at 2.42 GHz
    • One high-performance Gold Prime core at 2.84 GHz
    • Four low-power Kryo cores at 1.8 GHz
  • Qualcomm® Adreno™ 650 GPU
  • Qualcomm® Hexagon™ 698 DSP
  • Qualcomm® Spectra™ 480 Image Sensor Processor


  • 128GB UFS3.0 Flash


  • Qualcomm® Wi-Fi (QCA6391)11a/b/g/n/ac/ax 2.4/5.0 GHz 2×2 with MU-MIMO
  • Bluetooth 5.1 + HS and backward compatible with 1.x, 2.x + EDR
  • On-board PCB trace antennas


  • Qualcomm® WCD9385 audio codec on-board
  • 1x Headset headphone output
  • Audio Expansion Headers
    • 1x loud-speaker output
    • 1x Earpiece output
    • 2x Analog MIC input
    • 5x Digital MIC input


  • Adreno™ VPU 665 fifth generation UHD Video Processing Unit
  • Video decode up to 4K240 or 8K60
  • Video encode up to 4K120 or 8K30
  • Concurrent 4K60 decode and 4K30 encode for wireless display
  • New computer vision processor (CVP) for object detection and tracking

Display Interfaces

  • 2x 4-Lane MIPI DSI DPHY or 2x 3-Trio MIPI DSI CPHY via 2x 60-pin High Speed Display Connector
  • Optional Display/Expansion board mates to DSI connectors
  • HDMI 2.0 via DSI -> HDMI bridge chip (on-board), up to 4K @ 60Hz
  • DisplayPort 1.4 over USB3.1 Type-C

Camera Interfaces

  • 4x 4-Lane MIPI CSI camera ports with separate I2C control busses (CCI0/1/2/3) on 160-pin expansion header for optional camera board
  • Support for 3D Camera Configuration
  • Additional 2x 4-Lane MIPI CSI camera ports available on high speed expansion header

Power Input

  • 12V/5A input from wall adapter (included), or battery (not included)

Power Management

  • Qualcomm® Power and battery management (PM8250, PM8150A, PM8150B and PM8009)

OS Support

  • Android™ 10


  • 100 mm x 85 mm


  • 1x USB3.1 Gen 2 (10.0 Gbps) Type-C with DisplayPort video out
  • 1x PCIe v3 2-lane to M.2 socket
  • 1x microSD/UFS Card Socket
  • 2x USB 3.0 Type-A host via on-board hub
  • 1x USB micro-B debug UART
  • Sensor expansion headers
  • Low speed GPIO expansion header

Optional Accessories 

Product Brief

  • Snapdragon™ 865 Mobile HDK Product Brief

Unboxing Video

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

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