Open-Q™ 670 HDK Development Kit -

Open-Q™ 670 HDK Development Kit

Tech Specs


  • Qualcomm® Snapdragon™ SDA670 Octa-core 64 bit Kryo 360 CPU
    • Customized 64 bit ARM v8 compliant processor
    • 2X high-performance 2.016 GHz Kryo Gold cores
    • 6X low-power 1.708 GHz Kryo Silver cores
    • Qualcomm® Adreno™ 615 GPU with 64-bit addressing, designed for 430 MHz
    • Qualcomm® Hexagon™ 685 DSP dedicated for Computer Vision and Video Post Processing


  • 64GB eMMC 5.1 Flash Storage (non-PoP memory)


  • Qualcomm® Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2X2 MIMO (WCN3990) with MH4L antenna conn. and PCB antenna
  • Bluetooth 5.x + BLE


  • Encode: 4K30 8-bit: H.264/VP8/HEVC
  • Decode: 4K30 8-bit: H.264/HEVC/VP9 or 4K30 10-bit: HEVC/VP9
  • Concurrent: 4K30 Decode + 1080p30 Encode


  • Adreno 615, 3D graphics accelerator with 64-bit addressing, 430 MHz (maximum frequency)
  • OpenGL® ES 3.2, Vulkan®, DX12.2
  • OpenCL™ 2.0 DirectCompute, RenderScript


  • On-board Audio Codec (WCD9341)
  • 3.5mm headset jack
  • Audio input/output expansion headers

Power Management

  • Qualcomm® Power and battery management (PM670 + PM670L + SMB1355)

Display Interfaces

  • MIPI DSI connector with 1x 4-lane DSI port + Touch for included LCD panel accessory
  • HDMI Video output via DSI -> HDMI bridge chip on dev kit
  • VESA DisplayPort V1.3 on USB Type-C interface

Camera Interfaces

  • 3x 4-lane MIPI CSI interfaces on single camera connector
  • Qualcomm® Spectra™ ISP: Dual 14-bit + single Lite ISP: 16 +16 + 2 MP or 25MP 30fps
  • 25MP30 ZSL with dual ISP; 16 MP 30 ZSL with a single ISP


  • Qualcomm® SDR660 GNSS receiver with GPS/GLONASS/COMPASS/Galileo
  • PCB antenna and SMA connector option


  • 1x USB3.1
  • Type C with VESA DisplayPort V1.3
  • 1x USB micro-B serial UART


  • uSD card socket
  • NFC expansion header
  • Sensor expansion header

OS Support

  • Android™ 8 Oreo™


  • 12V/5A input from included wall adapter or 3000mAh Li-Ion battery


  • Mini-ITX form-factor — 170mm x 170mm


  • Included LCD Display Board: 5.65' FHD+ 2160×1080 resolution TFT with PCAP Touch panel via 4 lane MIPI DSI Interface
  • Optional Camera Board: IMX318 rear camera, IMX258 front camera, OV2281 Iris camera
  • Optional Sensor Board: Expansion board with gas, pressure, hall, UV, ALSP, magnetometer, accelerometer/gyro, humidity, temp. sensors.


  • Open-Q™ 670 Development Kit Datasheet

Additional Resources 

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

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