Open-Q™ Snapdragon 810 Development Kit | Intrinsyc Technologies

Dragonboard 810 Development Kit

Tech Specs


  • Snapdragon™ 810 (APQ8094)
    • Octa core ARM® Cortex® quad A57, quad A53
    • Qualcomm® Adreno™ 430 GPU
    • Qualcomm® Hexagon™ v5.5 DSP

I/O Interfaces

  • 1x UART debug header
  • 1x USB OTG micro-AB
  • 4x USB 2.0 host, 2x type-A, 2x front panel header
  • 2x USB 3.0 host, type-A
  • 1x PCIe v2.1
  • 2x SATA
  • 1x µSD Socket
  • 4x Digital IO 3x 20pin, 1x 24pin, expansion header, I2C, SPI, UART or GPIO


  • 802.11 a/b/g/n/ac Wi-Fi 2.4 GHz/5 GHz
  • Bluetooth 4.1
  • Qualcomm® IZat™ Gen8C GPS and GLONASS
  • TransferJet™

OS Support

  • Android™ 6 Marshmallow™


  • 4 GB LP-DDR4
  • 16 GB eMMC 5.0

Power Supply

  • 12V DC & ATX


  • 2x MIPI-DSI 4-lane, 60fps, up to 2560×1600 (single port),
  • 4096×2160 (dual port)
  • 1x HDMI 1.4a up to 3840×2160, 30fps


  • SOM 82mm x 40mm
  • Carrier board 170mm x 170mm


  • DragonBoard™ 810 Development Kit Datasheet

Additional Resources

Optional Accessories 

  • Open-Q™ Touchscreen/LCD 

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

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