Intrinsyc Technologies Corporation to Present at the Spring Investor Summit on April 1st and 2nd in New York City at the Essex House -

Press Release


Intrinsyc Technologies Corporation to Present at the Spring Investor Summit on April 1st and 2nd in New York City at the Essex House

VANCOUVER, BRITISH COLUMBIA – March 27, 2019 – Intrinsyc Technologies Corporation (TSX: ITC and OTCQX: ISYRF) (“Intrinsyc” or the “Company”), a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced that the Company will present and participate in 1-1 meetings at the Spring Investor Summit on April 1st and 2nd in New York City at the Essex House.

Tracy Rees, Chief Executive Officer, will present highlights from the Company’s record revenue and EBITDA performance in FY2018 as well as its strategic growth plan.

CONFERENCE OVERVIEW AND STRUCTURE
The Spring Investor Summit (formerly The MicroCap Conference) is an exclusive event dedicated to connecting small and micro cap companies with high-level, institutional and retail investors.

The Spring Investor Summit will take place in New York City at the Essex House on April 1st and 2nd. The upcoming conference will feature 200 presenting companies, 1200 institutional and retail investors, 2000 one-on-one meetings, expert speakers, and industry panels.

FOR MORE INFORMATION AND REGISTRATION
Please visit: www.springinvestorsummit.com
Attendees may request 1-1 meetings after registration on the website, or by sending an email to greznik@intrinsyc.com

ABOUT INTRINSYC TECHNOLOGIES CORPORATION
Intrinsyc provides comprehensive product development services, as well as the industry’s highest-performance production-ready computing modules, to enable rapid commercialization of embedded and Internet of Things (“IoT”) products. Intrinsyc has successfully delivered over 1,300 client projects including sophisticated consumer and industrial IoT products like: robotics, connected cameras, smart displays, augmented reality, smart buildings, wearables, in-vehicle infotainment, and many others. Intrinsyc’s Open-Q™ System on Modules incorporate the industry’s most advanced Qualcomm® Snapdragon™ processor technology from Qualcomm Technologies, Inc., and help OEMs to rapidly bring industry leading products, with rich functionality and high performance, to market. Intrinsyc is publicly traded (TSX: ITC and OTCQX: ISYRF) and is headquartered in Vancouver, BC, Canada; with additional product development centers in Taipei, Taiwan, and Bangalore, India.

For more information, please contact:
George Reznik
Chief Financial Officer
Intrinsyc Technologies Corporation
Email: Greznik@intrinsyc.com
Phone: +1-604-801-6461

 


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