Intrinsyc Announces Hardware Development Kit Featuring Qualcomm Snapdragon 845 Mobile Platform, Providing Innovative Architectures for Artificial Intelligence and Immersion
New Platform to Accelerate Development of Premium, Flagship Mobile Devices
VANCOUVER, BRITISH COLUMBIA – February 20,2018– Intrinsyc Technologies Corporation (TSX: ITC and OTC: ISYRF) (“Intrinsyc”), a leading developer of intelligent connected devices, today announced the general availability of a new Hardware Development Kit (“HDK”) featuring the Qualcomm® Snapdragon™ 845 Mobile Platform, a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.
The Snapdragon 845 Mobile Platform Introduces new, innovative architectures for artificial intelligence (“AI”) and immersion. The Snapdragon 845 utilizes Qualcomm Technologies’ cutting-edge wireless heterogenous compute expertise to design a platform for immersive multimedia experiences including eXtended reality (XR), on-device AI, lightning-fast connectivity, and introduces new secure processing unit (SPU) designed to deliver vault-like security for premium, flagship mobile devices.
To support the ecosystem of technology companies and application providers looking to utilize the advanced features of the Snapdragon 845, Intrinsyc Technologies Corporation is introducing the Open-Q™ 845 HDK. The HDK is an open-frame solution that empowers technology companies to integrate and innovate for devices based on the latest Snapdragon mobile platform, as well as provide original equipment manufacturers (“OEMs”), developers and engineers with next-generation software technology and tools to accelerate development and testing of devices. It includes all of the software tools and accessories required to immediately begin development work. The HDK is a full featured Android development platform that provides an ideal starting point for creating high-performance mobile devices and applications.
Open-Q™ 845 Hardware Development Kit Specifications:
Snapdragon 845 Mobile Platform with Qualcomm® Kryo™ 385 CPU (Four performance cores up to 2.8GHz – Four efficiency cores up to 1.8GHz), Qualcomm® Adreno™ 630 GPU, Secure Processing Unit, and Qualcomm® Hexagon™ 685 DSP
- System Memory: 6GB LPDDR4x RAM (POP)
- Storage: 128GB UFS V2.1 flash
- Wi-Fi® 802.11 a/b/g/n/ac/ad — Multigigabit 11ad Wi-Fi with diversity module and Integrated 2×2 11ac Wi-Fi with Dual Band Simultaneous (DBS) support
- Bluetooth® 5.0 Bluetooth 5 with proprietary enhancements for ultra-low power wireless ear bud support and direct audio broadcast to multiple devices
- GNSS (GPS/GLONASS/COMPASS/GALILEO)
- I/O Interfaces:
- 1x USB 3.1 Type C + 2x USB 2.0 Type A
- DisplayPort over USB 3.1 Type-C
- 1x Micro SD Card
- 1x PCIe
- HDMI 1.4 output – support up to 4K30Hz
- 1x MIPI dual 4-lane DSI + touch panel
- 3x MIPI CSI with support for 3D camera configuration
- 4x Expansion headers for additional features (NFC, sensors etc.)
- 1x Audio Input and 1x Audio Output Expansion Headers
- 1 JTAG
- Battery: 4V/2850mAh
- Operating System: Android 8
- Optional Accessory:
- Display: TFT QHD(1440 x 2560) with PCAP Touch Panel, 5.7”
“The Snapdragon 845 Mobile Platform pushes the boundaries of computing and power performance; with innovations in immersive multimedia, artificial intelligence, and security,” said Victor Gonzalez, Vice President, Engineering of Intrinsyc. “We are very excited to offer early access to a comprehensive development kit allowing technology companies and connected device makers to accelerate their product development using the powerful and innovative Snapdragon 845 Mobile Platform.”
Users of the Open-Q™ 845 development kit will receive product documentation and access to complimentary tools and software updates, and additional technical support or product development assistance through Intrinsyc’s technical support services.
The Open-Q™ 845 Development Kit is available to order at https://shop.intrinsyc.com/products/open-q-845-development-kit
About Intrinsyc Technologies Corporation
Intrinsyc Technologies is a product development company that provides comprehensive and tailored solutions that enable the development and production of next-generation intelligent connected devices. Solutions span the product development life cycle from concept to production and help makers of intelligent connected devices create compelling differentiated products with faster time-to-market. Intrinsyc is publicly traded (TSX: ITC and OTC: ISYRF) and is headquartered in Vancouver, BC, Canada. See www.intrinsyc.com for more information.
For more information, please contact:
Vice President, Engineering
Intrinsyc Technologies Corporation
Intrinsyc and Open-Q are trademarks of Intrinsyc Technologies Corporation.
Qualcomm, Snapdragon, Kryo, Adreno, and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.
Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Adreno, and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Bluetooth is a registered trademark of Bluetooth SIG, Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Other products or brand names may be trademarks or registered trademarks of their respective owners.