Intrinsyc Announces Hardware Development Kit Featuring Qualcomm® Snapdragon™ 660 Mobile Platform
Featuring Qualcomm Technologies’ most powerful 600-tier mobile platform to-date, supporting Qualcomm® Kryo™ CPU for the first time in 600-tier
VANCOUVER, BRITISH COLUMBIA – October 2, 2017 – Intrinsyc Technologies Corporation (TSX: ITC and OTC: ISYRF) (“Intrinsyc”), a leading developer of intelligent connected devices, today announced the general availability of a new Hardware Development Kit (“HDK”) featuring the Qualcomm® Snapdragon™ 660 Mobile Platform.
To support the ecosystem of technology companies and application providers looking to utilize the advanced features of the Snapdragon 660, Intrinsyc Technologies Corporation is introducing the Open-Q™ 660 HDK. The HDK is an open-frame solution that empowers technology companies to integrate and innovate for devices based on the latest Snapdragon mobile platform, as well as provide original equipment manufacturers (“OEMs”), developers and engineers with next generation software technology and tools to accelerate development and testing of devices. It includes all of the software tools and accessories required to immediately begin development work. The HDK is a full featured Android development platform that provides an ideal starting point for creating high-performance mobile devices and applications.
The Snapdragon 660 Mobile Platform is the most powerful 600-tier platform to date, with Qualcomm Spectra™ ISP, Kryo CPU, and Qualcomm® Hexagon™ DSP with Hexagon Vector eXtensions (HVX) supported for the first time in the 600-tier. The Snapdragon 660 is designed to provide a leap in performance; supporting advanced photography and enhanced gaming, in addition to long battery life for top-tier mobile devices. Snapdragon 660 offers up to 20% higher CPU performance and 30% higher graphics performance compared to the prior generation.
Open-Q™ 660 Hardware Development Kit Specifications:
- Qualcomm® Snapdragon™ 660 Mobile Platform with Qualcomm® Kryo™ 260 CPU (up to 2.2GHz), Qualcomm® Adreno™ 512 GPU, and Qualcomm® Hexagon™ 680 DSP with Hexagon Vector extensions
- eMCP: 64GB eMMC 5.1 + LPDDR4x up to 1866MHz 6GB RAM
- Wi-Fi® 802.11ac 1×1 with MU-MIMO
- Bluetooth 5.0
- GNSS (GPS/GLONASS/COMPASS/GALILEI)
- I/O Interfaces:
- 1x USB 3.1 Type-C with DisplayPort output
- 1x USB 2.0 Host
- 1x USB 2.0 micro-B (UART Logging)
- 1x Micro SD Card
- 2x MIPI 4-lane DSI + touch panel
- 3x MIPI 4-lane CSI with support for 3D camera configuration
- Expansion headers for additional features
- 20-pin NFC
- 24-pin Sensor I/O
- ANC Headset
- 1x Audio Input and 1x Audio Output Expansion Headers
- 1 JTAG
- Operating System: Android 7
- Optional Accessories:
- Battery: 4.35V/3000mAh
- Display: AMOLED LCD (1920×1080) with PCAP Touch Panel, 5.7”
- Cameras: 8M FF, Single 12M 2PD, Dual 12M+13M OZ+OIS
“The Snapdragon 660 Mobile Platform supports many features previously found only in the premium-tier 800 Series, offering a great value for mobile device developers,” said Victor Gonzalez, Vice President, Global Engineering, Intrinsyc Technologies Corporation. “The HDK provides device makers and technology companies early access to the Snapdragon 660 Mobile Platform and all the software, tools, and support, they need to accelerate their product development.”
Users of the Open-Q™ 660 Development Kit will receive product documentation and access to complimentary tools and software updates, and additional technical support or product development assistance through Intrinsyc’s technical support services.
The Open-Q™ 660 Development Kit is available to order at https://shop.intrinsyc.com.
About Intrinsyc Technologies Corporation
Intrinsyc Technologies is a product development company that provides comprehensive and tailored solutions that enable the development and production of next-generation intelligent connected devices. Solutions span the product development life cycle from concept to production and help makers of intelligent connected devices create compelling differentiated products with faster time-to-market. Intrinsyc is publicly traded (TSX: ITC and OTC: ISYRF) and is headquartered in Vancouver, BC, Canada. See www.intrinsyc.com for more information.
For more information, please contact:
Vice President, Engineering
Intrinsyc Technologies Corporation
Intrinsyc and Open-Q are trademarks of Intrinsyc Technologies Corporation.
Qualcomm, Snapdragon, Kryo, Adreno, and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Spectra is a trademark of Qualcomm Incorporated.
Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, and Qualcomm Hexagon are products of Qualcomm Technologies, Inc.