17 Jan 2018

Oreo for Open-Q™ 820

 

Intrinsyc Technologies Corporation has released Android 8 “Oreo” for both the Open-Q™ 820 Development Kit and the Open-Q™ 820 µSOM Development Kit.

This new BSP software is now available to register 820 or 820 µSOM customers for download from Intrinsyc’s support site.  Release notes, BSP source, and software update packages are available there.

In addition to being the first Snapdragon™ 820 development kit featuring Android 8, this release also includes a number of new features and addresses several known issues from past software releases. These are detailed in the release notes and BSP Programmer Guide documents on the support site.

Android 8 brings a significant update to the User Interface, Battery Management, and numerous other improvements. It also has a new BSP architecture thanks to Google’s Project Treble.

More streamlined updates

Project Treble restructures Android, separating vendor-specific binaries from the generic Android system.  This allows more streamlined code and update management, where Android system/framework files can be updated while leaving the vendor portion unchanged.  Vendors create support for new silicon platforms using the VNDK (Vendor Native Development Kit), while the Android system partition can remain agnostic of the platform-specifics.  This allows vendors to more easily keep their devices in the field aligned with new releases of Android.

Due to this new architecture, Android O introduces a new “vendor” partition for vendor-specific files.  Current internal flash storage needs to be re-partitioned during upgrade from previous Android versions. Users will lose their data in internal storage during the upgrade.  Intrinsyc provides upgrade and downgrade packages for Android O on the Open-Q 820 development kits.

Developing with Android O

Within the Android build, there’s a new build command to generate vendor.img for the vendor partition:

make vendorimage

For the SnapDragon™, the build behavior is controlled by ENABLE_VENDOR_IMAGE flag in device/qcom/msm8996/* & device/qcom/common/*.

The vendor partition will be mounted during “first stage mount”.

Instead of defining mounting info in previous device/qcom/msm8996/fstab.qcom, the new “first stage mount” requires the initial mounting info to be defined in device tree (kernel/msm-3.18/arch/arm/boot/dts/qcom/msm8996.dtsi).  The mount file device/qcom/msm8996/fstab.qcom has been renamed and is now called fstab_non_AB_variant.qti.

You can find related detailed kernel information in kernel/msm-3.18/Documentation/devicetree/bindings/arm/msm/android.txt.

References:

https://source.android.com/devices/architecture/treble

https://source.android.com/devices/architecture/vndk

https://source.android.com/devices/architecture/kernel/modular-kernels#mounting-partitions-early-first-stage-mount


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