Buy SBC - Single Board Computers based on Qualcomm Snapdragon

Open-Q™ 605 Single Board Computer

Tech Specs


  • Qualcomm® Kryo™ 300 Octa-core 64-bit ARM v-8 compliant CPU built on 10nm LPP technology, with:
    • Kryo Gold: Two high-performance cores up to 2.5 GHz
    • Kryo Silver: Six low-power cores up to 1.7 GHz
  • Qualcomm® Hexagon™ 685 DSP + Adreno™ 615 GPU supporting artificial intelligence and machine learning


  • Non-PoP, combo eMCP chip with 4GB LPDDR4X SDRAM and 32GB eMMC Flash storage


  • Wi-Fi 802.11b/g/n/ac 2×2 MIMO (WCN3990 ) + Bluetooth 5.x, U.FL antenna connectors

Camera Interfaces

  • 2x 4-lane MIPI CSI to micro camera module connectors
  • 2x Qualcomm® Spectra™ 270 14-bit image signal processors

Embedded Display

  • 4-lane MIPI DSI + I2C touch interface on flex cable connector to support optional LCD panel up to 1080p at 30fps

External Display

  • DisplayPort 1.4 via USB Type-C up to 4K at 30fps with USB data concurrency

Location— GNSS

  • Qualcomm® GNSS receiver (SDR660G), Integrated Qualcomm® Location Suite Gen9 VT, U.FL antenna connector


  • Integrated audio codec with speaker amp provides 2x analog mic I/Ps, 1x speaker O/P, headset I/O
  • I2S/SLIMBus digital audio interface + 2x DMIC ports on expansion header for other audio I/O options

USB Interface

  • USB3.1 Type-C interface with DisplayPort video output and Quick-Charge capability

Micro SD Card

  • Micro SD card socket for additional, removable storage.

Expansion Header

  • 76 Pin header with:
    • Multiple SPI, I2C, UART, GPIO, and sensor I/O interfaces
    • Digital and analog audio I/O, LED flash O/P, haptic O/P, power output rails

Power Management

  • Qualcomm® power management system (PM670 + PM670L) provides power, clocks, housekeeping, battery charging and fuel gauge, integrated audio codec

Optional Accessories

User Interface

  • Three buttons and three LEDs for user control and status indication

Power Input

  • 5V -> 15V DC external power or single-cell Lithium Ion battery (not included), charged by USB Type-C

OS Support

  • Android™ 9

Form Factor

  • 50mm x 68mm x 13mm, with four mounting holes, panel-ready power jack, μSD socket and USB Type-C

Operating Temp.

  • Operating Temperature: -25°C to +85°C Tc (component case temperature)


  • FCC/IC/CE pre-certified Wi-Fi/BT (planned), ROHS/REACH compliant (planned)

Qualcomm Snapdragon, Qualcomm Adreno, Qualcomm Hexagon are products of Qualcomm Technologies, Inc.


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