NXP® i.MX 8M™ processor powered Open-X™ 8M Development Kit

Open-X™ 8M Development Kit based on the NXP® i.MX 8M™ Processor

Tech Specs


NXP Approved Engineering Consultants Partner

Open-X™ 8M SOM powered by the NXP® i.MX 8M™

  • Processor
    • Quad-core ARM Cortex-A53 MPCore at 1.5 GHz + single-core ARM Cortex-M4
  • Memory/Storage
    • 3GB LPDDR4 RAM, 16GB eMMC Flash
  • Wireless
    • WLAN 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1—pre-certified module (FCC/IC)

Display Interfaces

  • HDMI Type-A connector supporting HDMI 2.0a for 4096 x 2160 @ 60Hz
  • MIPI DSI display connector for optional LCD / Touch Panel to mount on carrier board

High Speed Connectivity

  • 1x USB3.0 Type-A
  • 1x USB3.0 Type-C
  • Gigabit Ethernet J45

Audio Interfaces

  • 3.5mm line-level stereo output
  • Audio expansion:
    • 1x 16 channel bi-directional SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 1x 8 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 1x 2 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
    • 1x S/PDIF input and output

Camera Interfaces

  • 2 x MIPI CSI2 camera connectors for optional camera module

Expansion Sockets

  • M.2 socket with PCIe Gen2, USB HS, UART, I2C, I2S
  • microSD card socket

Debug Features

  • JTAG header
  • dual debug UART (1 Cortex-A53 debug, 1 Cortex-M4 debug) on USB serial micro-B

I/O Expansion

  • I2C
  • NAND interface
  • GPIO


  • Input Power: 12V/3A to barrel jack (power supply included) or USB Type-C power
  • Power probe header for SOM power consumption measurement

OS Support

  • Android™ 8
  • Linux®

Form Factor

  • SOM size: 55mm x 35mm
  • Carrier Board size: Mini-ITX 170mm x 170mm with on-board mounting for optional LCD panel


  • Two WLAN/Bluetooth PCB antennas on carrier board with coaxial connection to SOM

Optional Accessories


  • Open-X™ 8M Development Kit Datasheet

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners.

Intrinsyc and Open-X and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

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