Open-X™ 8M System on Module (SOM) based on the NXP® i.MX 8M™ Processor


Tech Specs

Processors

  • Quad-core ARM Cortex-A53 MPCore platform:
    • Quad symmetric Cortex-A53 processors: 32 KB L1 Instruction Cache, 32 KB L1 Data Cache
    • Support of 64-bit ARMv8-A architecture: 1 MB unified L2 cache, Frequency of 1.5 GHz
  • ARM Cortex-M4 core platform:
    • 16 KB L1 Instruction Cache, 16 KB L1 Data Cache, 256 KB tightly coupled memory (TCM)

Memory/Storage

  • 3GB LPDDR4 RAM
  • 16GB eMMC Flash

Video Processing Unit

  • 4Kp60 HEVC/H.265 main, and main 10 decoder
  • 4Kp60 VP9 decoder
  • 4Kp30 AVC/H.264 decoder
  • 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder

Graphic Processing Unit

  • 4 shader
  • 267 million triangles/sec
  • 1.6 Giga pixel/sec
  • 32 GFLOPs 32-bit or 64 GFLOPs 16-bit
  • Supports OpenGL ES 1.1, 2.0, 3.0, 3.1, Open CL 1.2, and Vulkan

Display Interfaces

  • HDMI 2.0a supporting resolution up to 4096 x 2160 at 60 Hz
  • 4-lane MIPI DSI interface supporting display resolution up to 1920×1080 at 60 Hz

Camera Interface

  • 2x 4-lane MIPI CSI2 camera inputs

Audio Interfaces

  • S/PDIF input and output
  • 1x 16 channel bi-directional SAI digital audio interface supporting I2S, AC97, TDM, DSP
  • 1x 8 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
  • 2x 2 channel bi-directional SAI digital audio interface (I2S, AC97, TDM, DSP)

I/O

  • 2x USB 3.0
  • 1x PCIe Gen2
  • Gigabit Ethernet
  • 4-bit SDIO
  • 2x debug UART
  • JTAG

Operating Environment

  • Input power: 3.3V
  • Operating Temperature: 0°C to +70°C
  • *for other temperature range options contact sales

Form Factor

  • Size: 55mm x 35mm
  • Carrier Board Interface: 3 x 100 pin board to board connectors

Power Management

  • Power management IC: NXP PF4210

Wireless

  • WLAN 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1 pre-certified module

OS Support

  • Android™ 8
  • Linux® (coming soon)

Datasheet

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners.

Intrinsyc and Open-X™ and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.


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