Open-Q™ 845 micro System on Module (µSOM) -

Open-Q™ 845 micro System on Module (µSOM)


Tech Specs

Processors

  • Qualcomm® Snapdragon™ SDA845 built on 2nd-Gen 10nm technology
    • Qualcomm® Kryo™ 385 CPU: 4 Kryo Gold 2.649GHz cores + 4 Kryo Silver low-power 1.766GHz cores
    • Qualcomm® Hexagon™ 685 DSP with Hexagon Vector eXtensions (dual-HVX512)
    • Qualcomm® Adreno™ 630 GPU with OpenGL® RD 3.2 + AEP, DX next, Vulkan® 1.1, OpenCL™ 2.0 full profile

Memory/Storage

  • 4GB or 6GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz
  • 32GB or 64GB UFS Flash Storage

Wireless

  • Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5 GHz external PA & U.FL antenna connector
  • Bluetooth 5.x

Display Interfaces

  • 2x 4-lane MIPI DSI D-PHY 1.2, up to 3840 × 2400 10-bit 60 fps
  • VESA DisplayPort v1.4 on USB Type-C, up to 4K60 with USB data concurrency

Camera Interfaces

  • 3x 4-lane MIPI CSI + 1x 2-lane MIPI CSI
  • Qualcomm® Spectra™ 280 ISP: 16 +16 + 2 MP sensor resolution
  • 32MP 30fps ZSL with dual ISP; 16 MP 30 ZSL with a single ISP

Video

  • Encode: 4K60 for H.264/H.265, 4K30 for VP8
  • Support for HDR 10-bit capture (HLG)
  • Decode: 4K60 H.264/H.265/VP9
  • Support for HDR 10-bit video playback (HLG, HDR10)

Audio Interfaces

  • Dedicated audio DSP integrated with support for external WCD9340 codec and WSA8810/WSA8815 speaker amps
  • 1x SLIMBus interface for external Qualcomm® Codecs
  • 1x 4-lane MI2S interface + 2x 2-lane MI2S interfaces (muxed with SLIMBus) for other external audio devices

I/O interfaces

  • 2 USB ports: 1x USB3.1 with support for Type-C + DisplayPort v1.4 with USB data concurrency, 1x USB 3.1
  • 1x PCIe Gen3 1-lane, 4-bit SD 3.0, UART, I2C, SPI, configurable GPIOs

Sensor Core Interface

  • SPI, I2C, GPIO connections to sensor core DSP

Power/Battery Management

  • Power management and battery charging solution on SOM
  • Qualcomm® PM845 + PM8998 + PM8005

Operating Environment

  • Input voltage: 3.5V to 4.7V
  • Operating Temperature: -25°C to +85°C Tc (component case temperature)

Form Factor

  • 50mm x 25mm with 3x 100 pin board to board connectors

OS Support

  • Android™ 9 Pie based on kernel v4.9
  • Linux OS based on Yocto Rocko, kernel v4.9

Datasheet

Unboxing Video

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Q ualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Cortex is a trademark of ARM Holding plc. Used with permission.

Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.


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