Silicon Vendor Partners
Intrinsyc works closely with its silicon vendor partners to develop Soleus hardware reference platforms that showcase leading edge technology for smart handset development.
Freescale
Intrinsyc worked closely with Freescale to integrate Soleus with the i.MX31 multimedia applications processor to create a comprehensive handset development platform that offers mobile phone manufacturers and network operators a low-risk, cost-effective and faster way to build handsets using the i.MX31. For this work, Freescale awarded Intrinsyc its Partner Software Solution of the Year for 2006.
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Enfora, Inc.
Intrinsyc worked with Enfora, a radio module developer and wireless device manufacturer, to develop a complete GSM/GPRS/EDGE feature phone design. The design combines Intrinsyc's Soleus platform with a dual-core architecture radio module based on TI’s OMAP850 applications processor and developed by Enfora. The key to our partnership has been matching Enfora's radio module designs and device integration skills with Intrinsyc's OS and BSP skills encapsulated in Soleus. Together we’ve developed innovative development platforms that enable a wide variety of feature phone handset manufacturers to quickly bring handset designs to market.
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Texas Instruments
Intrinsyc worked with Texas Instruments to develop a Soleus feature phone reference design based on TI’s OMAP850 processor. Intrinsyc is a certified OMAP Technology Center that has completed successful projects with Texas Instruments for over five years. TI chose Intrinsyc as a lead partner for the OMAPP2420 and OMAPP2430 processors because they recognized our leadership in the Microsoft mobile devices ecosystem and our proven ability to deliver best-in-class development services.
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